AndroidⅡ

Precision Micro Machining Center

Android was originally developed based on the concept of “pursuing real machining precision of ±1 μm”. We have reduced displacement as much as possible and made improvements to achieve higher precision machining, even in high speed machining conditions. These brush-ups have resulted in a next-generation model of Android that meets higher level demands from our customers. We have named it the “Android II Ultra High-Precision High-Speed Micro Machining Center”

Axle Movement (XYZ) 450 / 350 / 200mm
Spindle Speed 3,000 - 60,000 rpm
Spindle Taper Hole 1/10 short taper (2-sided restraint)
Tool Shank Format HSK-E25
ATC Tool Storage Capacity 20tools (OP: 40 / 60 / 100 tools)
Machine Weight 5,800kg

Features

Spindle Horizontally Opposed Mounting Linear Motor Drive

  • Each spindle is equipped with two linear motors. The suction force of each one is completely offset, and the eccentric load on moving objects and guide surfaces is fully suppressed.
  • A double cooling system is used inside the coil and mounting part, in order to counter heat sources.
  • Mounted Scale Feedback: The highest level resolution of 0.00025 μm (0.25 nm) and a fully closed loop system ensure stable positioning performance by absolute matching actual distance traveled to command value.
  • 主軸変位量

Special Ultra Precise Rolling Guide Surface

  • Realizes both high rigidity and smooth non-stick, non-slip spindle movement
  • Expanding the support width of the carriage guide causes an averaging effect that ensures improved straightness.
  • The contact surface is expanded to be about 6 times wider than a conventional guide surface. Unique specifications suppress waving on both the X and Y axes to about 1/20th of conventional values, to 0.02 – 0.07 μm / 20 mm in the horizontal and vertical planes.

Other features

キャリッジ冷却

■ Evolution of Android

◆ Higher precision
・Stronger measures against thermal displacement (Active H.I.S.)
1. Strengthening measures for heat exhaust
By improving ventilation efficiency around linear motors of the main spindle and each axis (X, Y, Z axes), it reduces thermal displacement in the Y-axis direction
2. Guide part carriage cooling
Maintains high precision for long periods of time by cooling the guide part, which is a source of heat
*Active H.I.S.: Active Heat Isolation System

ASC機能2 タッチパネルロガー

■ Evolution of visualization
◆ Evolution of M-Kit
1. Measurement Points: 16
2. Uses Touch Panel logger
◆ ASC Function
Automatically detects saturation of the spindle
Reduces warm-up time and shortens non-machining time

* “ASC Function”: Auto Saturation Check

Features

Ultra High Precision Added Shaft Specification Machine: Android / 5AXP

This machine has specially engineered simultaneous five-axis control specifications, which promise ultra high-precision machining, thanks to the Android II’s XYZ 3-axes positioning capabilities and extremely small thermal displacement.This machine has specially engineered simultaneous five-axis control specifications, which promise ultra high-precision machining, thanks to the Android II’s XYZ 3-axes positioning capabilities and extremely small thermal displacement.
Supports multiple applications, including ultra high-precision dies, medical, optical, and electronic device part processing.

5軸
  • Exclusive design that comes standard with scale feedback on both the tilt axis and rotation axis
  • Strong support rigidity is ensured with the pneumatic clamp system when machining with the shaft tilted
  • Can be equipped with chucks from various holder companies (Erowa / System 3R: Special specifications)

Automatic Holder Changer (AHC)

  • Change Precision: ±1μm (actual measurement value)
  • Changer positioning elements are compatible with various holder companies (Erowa / System 3R)
  • A rich software setup that is flexibly compatible with schedule management functions and emergency interrupts that support long-time operation
  • Unique chip treatment enabling completely unmanned continuous operation
    A dedicated nozzle for cleaning on jigs, and a forced chip discharge mechanism
    Specifications which have a proven record of verifying in detail and responding to the possibility of chip contamination
AHC [Specifications 1] AHC [Specifications 2]
Work Stocks: 24 / 40 / 60 units 10 units
Max Dimensions of Carried Object [W x D (mm)]: 70 x 70 230 x 230
Max Dimensions of Carried Object [With nothing adjacent (mm)]: 70 x 130 230 x 230
Max Height of Carried Object (mm): 130 (including holder height) 130 (including holder height)
Max Weight of Carried Object (kg): 5 (including holder) 20 (including holder)

Please use the inquiry form to make inquiries to Roku-Roku Sangyo, Ltd.